Underfill dispensing solution provider

With the development trend of miniaturization, portability and functional diversification of electronic products, bottom filling has become a necessary process to improve the reliability of electronic products. For CSP, BGA and pop, bottom filling can improve their impact resistance; For flip chip, thermal stress is generated due to its inconsistent coefficient of thermal expansion (CTE), resulting in solder ball failure. Bottom filling improves its ability to resist thermal stress.

Programme background

Underfill technology originated in IBM in the 1970s and has become an important part of the electronic manufacturing industry. At first, the application scope of this technology was limited to ceramic substrates. Until the industry transited from ceramic substrates to organic (laminated) substrates, the underfill technology was applied on a large scale, and the use of organic underfill materials was determined as an industrial standard.

Program features

With the development trend of miniaturization, portability and functional diversification of electronic products, bottom filling has become a necessary process to improve the reliability of electronic products. For CSP, BGA and pop, bottom filling can improve their impact resistance; For flip chip, thermal stress is generated due to its inconsistent coefficient of thermal expansion (CTE), resulting in solder ball failure. Bottom filling improves its ability to resist thermal stress.

Program advantages

In terms of bottom filling process, PCB & FPC manufacturers always face the challenge of balancing output, materials, labor & equipment investment on the premise of meeting the bottom filling accuracy. The traditional needle cylinder bottom filling method usually has low requirements for bottom filling accuracy and efficiency. Although the accuracy and efficiency of using foreign equipment can meet the requirements, the purchase cost and after-sales service cost are often unbearable for PCB & FPC manufacturers. Shichun's bottom filling equipment provides great advantages for manufacturers from small batch production to online high-yield production. The system is equipped with the core product injection valve with independent intellectual property rights, mature and stable motion platform and independently developed control software. The system can meet various special customer application needs, so as to greatly save costs and improve output and productivity. The core components are independently produced with sufficient spare parts. A perfect service support network has been established nationwide to respond to customer needs very quickly, And reduce the after-sales service cost to make the investment return of PCB & FPC manufacturers faster.

High speed, stable operation can be ensured at the speed of 1000mm / s, so it is higher than UPH. Compared with peer equipment, it achieves the same repetition accuracy and shorter setting time.