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Hot melt adhesive earphone dispensing

Release date:2021-08-23 09:36   Views:
headset
Sound quality, lightweight and waterproof
In addition to the requirements of comfortable wearing, rich sound quality, noise reduction, voice control and simple operation, the waterproof grade of earphones should also reach IP45. The earphone is compact as a whole, and the layout of various components is compact. Glue is needed for connection, fixation, sealing and bonding.
Process characteristics
Dispensing of main components includes: shell bonding, IC underfill, PCB encapsulation, wire speed fixing, proximity sensor bonding, horn bonding, solder joint encapsulation, MEMS encapsulation, key filling and encapsulation, USB sealant, PCB coating and other processes;
Due to the small product parts and compact design structure, some stations can only carry out semi-automatic operation, which is difficult to realize full-automatic assembly;
Yiren dispensing scheme: provide automatic visual platform, cooperate with different dispensing valves to facilitate dispensing operations in different processes of the production line;


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